Intel RC ACPI Settings |
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PTID Support |
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PTID是电源/监视芯片,本选项允许启用/禁用电源和温度仪器详细信息,设置为禁用则会从BIOS删除SSDt表之一的PtidDevc |
PECI Access Method |
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ACPI |
PECI(Platform Environment Control Interface)为用于监测CPU及芯片组温度的一线总线 |
Native PCIE Enable |
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开启时操作系统可控制热插拔、SHPC本地热插拔控制、电源管理事件、PCIe高级错误报告控制、PCIe能力结构控制、时延容忍报告控制,禁用时由BIOS控制 |
Native ASPM |
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启用时由操作系统控制设备的ASPM(Active State Power Management,主动性电源管理)支持,禁用时由BIOS控制 |
Wake system from S5 |
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从S5事件中唤醒系统 |
ACPI Debug |
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调试ACPI |
Low Power S0 Idle Capability |
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在S0低功耗模式(现代待机模式)下,系统将保持部分运行,在网络可用且实时动作需要完成(如系统维护)时唤醒 |
10sec Power Button OVR |
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EC Notification |
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EC通知 |
EC CS Debug Light |
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Caps Lock指示灯 |
EC Low Power Mode |
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EC低电量模式 |
EC Debug LED |
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EC调试LED灯 |
EC Base CS Power Policy |
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Sensor Standby |
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传感器待机 |
CS PL1 Limit |
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CS PL1 Value |
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Lpit Recidency Counter |
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Intel Ready Mode Technology |
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Intel Ready Mode与传统睡眠模式相似,使电脑进入安静运行且低功耗的状态,与手机和平板电脑待机时使用的模式相近 |
HW Notification |
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Intel RMT State |
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Intel Ready Mode技术状态 |
PCI Delay Optimization |
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Type C Support |
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Type-C支持 |
PEP Constraints Configuration |
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PEP CPU/Graphics/UART |
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在PEP mitigation list中开启或关闭CPU/Graphics/UART选项 |
PEP ISP |
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PEP SATA Controller |
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PEP RAID VOL0 |
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PEP SATA PORT0-5 |
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PEP SATA NVM1-3 |
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PEP I2C0-I2C5 |
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在PEP mitigation list中开启或关闭PEP I2C0-PEP I2C5选项 |
PEP SPI |
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在PEP mitigation list中开启或关闭PEP SPI选项 |
PEP XHCI/Audio/EMMC/SDXC |
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在PEP mitigation list中开启或关闭XHCI/Audio/EMMC/SDXC选项 |
PEP WIGIG F1 |
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CPU Configuration |
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SW Guard Extensions (SGX) |
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SGX即Software Guard Extensions,应用程序可以使用它来创建和访问私有内存区域,选择Enabled或Software Controlled时将启用SGX,其中选择Enabled时预留的私有内存大小由BIOS设置,选择Software Controlled时预留的私有内存大小由操作系统指定 |
Select Owner EPOCH input type |
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更改所创建的锁定内存区域的安全密钥的种子(Intel驱动程序通过该种子创建一个密钥来锁定私有内存区域) |
Software Guard Extensions Epoch 0 |
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系统生成并显示的EPOCH值 |
Software Guard Extensions Epoch 1 |
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系统生成并显示的EPOCH值 |
PRMRR Size |
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CPU Flex Ratio Override |
0x4EE |
0x1 |
Enabled |
CPU倍频手动设置 |
CPU Flex Ratio Settings |
0x4EC |
0x3F |
Maximum |
CPU倍频手动设置 |
Hardware Prefetcher |
0x5BE |
0x1 |
Enabled |
让CPU在L2 Cache进行预取反馈和数据 |
Adjacent Cache Line Prefetch |
0x5BF |
0x1 |
Enabled |
让L2 Cache的中间缓存线运行相邻缓存线预取功能 |
Intel (VMX) Virtualization Technology |
0x5B8 |
0x1 |
Enabled |
Intel硬件辅助虚拟化技术 |
PECI |
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PECI(Platform Environment Control Interface)为用于监测CPU及芯片组温度的一线总线 |
Active Processor Cores |
0x4F1 |
0x0 |
All |
激活处理器的硬件核心数 |
Execute Disable Bit |
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病毒防护技术 (Execute Disable Bit) 让处理器针对内存区域进行分类,以判断程序是否安全可执行 |
Limit CPUID Maximum |
0x4EA |
0x0 |
Disabled |
开启时cupid toreturn将返回最大值3 |
Hyper-Threading |
0x4F0 |
0x1 |
Enabled |
禁用时每个启用的核心只启用一个线程,在运行需要尽可能短的响应时间的应用程序时可设为Disabled |
BIST |
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内建自检 |
JTAG C10 Power |
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启用/禁用C10及以上电源状态下的Power JTAG |
AP threads Idle Manner |
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等待信号运行的AP线程空闲方式 |
AP threads Handoff Manner |
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AP线程从POST结束切换到OS方式 |
AES |
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启用/禁用AES (高级加密标准,Advance Encryption Standard) |
MachineCheck |
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机器检查 |
MonitorMWait |
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Intel Trusted Execution Technology |
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启用英特尔可信执行技术(Trusted Execution Technology)提供的额外硬件功能 |
Alias Check Request DPR Memory Size (MB) |
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Reset AUX Content |
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重置TPM辅助内容(在AUX内容被重置后,Txt可能不起作用) |
Flash Wear Out Protection |
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Current Debug Interface Status |
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当前调试界面状况 |
Debug Interface |
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调试界面 |
Direct Connect Interface |
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直连界面 |
Debug Interface Lock |
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调试界面锁 |
Processor trace memory allocation |
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禁用/选择处理器跟踪(内存区域大小为4KB-128MB) |
Processor trace |
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Intel处理器跟踪,利用硬件来记录程序执行的轨迹 |
SMM Processor Trace |
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SMM处理器追踪 |
FCLK Frequency for Early Power On |
0x5F9 |
0x1 |
1Ghz |
减少PCIE的延迟,稍微提升PCIE设备性能 |
Voltage Optimization |
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电压优化 |
CPU SMM Enhancement |
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SMM MSR Save State Enable |
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SMM Code Access Check |
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SMM代码权限检查 |
SMM Use Delay Indication |
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启用/禁用SMI中用于MP同步的SMM_DELAYED MSR |
SMM Use Block Indication |
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启用/禁用SMI中用于MP同步的SMM_BLOCKED MSR |
SMM Use SMM en-US Indication |
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CPU - Power Management Control |
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Boot performance mode |
0x4F7 |
0x2 |
Turbo Performance |
BIOS在系统切换前设置的启动模式 |
Intel SpeedStep |
0x4F4 |
0x1 |
Enabled |
处理器性能状态(P状态) |
Race To Halt (RTH) |
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快速增加工作负荷以快速进入睡眠状态 |
Intel Speed Shift Technology |
0x4F6 |
0x1 |
Enabled |
Intel CPU节电技术、状态调整,大大提高响应速度 |
HDC Control |
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HDC配置 |
Turbo Mode |
0x4FA |
0x1 |
Enabled |
睿频模式(EMTTM必须启用) |
Platform PL1 Enable |
0x515 |
0x0 |
Disabled |
Platform 1功耗限制 |
Platform PL1 Power |
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Power Limit 1 Time Window |
0x500 |
0x80 |
Maximum |
超频最长时间 |
Platform PL2 Enable |
0x51B |
0x0 |
Disabled |
Platform 2功耗限制 |
Platform PL2 Power |
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Power Limit 4 Override |
0x50E |
0x1 |
Enabled |
无视超频功率4限制 |
Power Limit 4 |
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Maximum |
Platform 4功耗限制值 |
Power Limit 4 Lock |
0x513 |
0x0 |
Disabled |
Platform 4功耗限制锁 |
C states |
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CPU核心睡眠深度(CPU全速运行时候会工作在C0,任务量较时会工作在C1,CPU核心休眠的时候会工作在C7,当CPU核心从睡眠状态唤醒需要比较高的延迟,通常比内存延迟高得多) |
Enhanced C-states |
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C1E状态,让处理器在闲置时降低电力消耗 |
C-State Auto Demotion |
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C1 and C3 |
一般来说,较深的C-states(如C6或C7)具有较长的延迟,并且具有较高的能量进入/退出成本。当更深的C-states的进入/退出频率很高时,产生的性能和能量损失就会变得非常严重。因此,不正确或低效率地使用更深层次的c状态会对电池空闲时间产生负面影响。为了增加驻留时间和提高电池在更深的C-states下的空闲时间,处理器支持C-states自动降级 |
C-State Undemotion |
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C1 and C3 |
C-State不降级 |
Package C-State Demotion |
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Package C-State降级,利用历史信息通过避免从深层Package C-State到浅层Package C-State的多次转换来节省电能 |
Package C-State Un-demotion |
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在确定Package C-state的层级前降级是不正确的,该选项使处理器能够切换回原来请求的深层Package C-State |
CState Pre-Wake |
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使用core/package C-state Pre-Wake定时器启用或禁用core/package在深层C-state中的早期唤醒功能 |
IO MWAIT Redirection |
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Package C-State Limit |
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设置CPU Package的C-State支持,允许处理器的单个核心或整个处理器进入休眠状态 |
View/Configure Turbo Options |
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Energy Efficient P-state |
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节能P-state模式 |
Package Power Limit MSR Lock |
0x514 |
0x0 |
Disabled |
MSR锁 |
Power Limit 1 Override |
0x4FF |
0x1 |
Enabled |
无视超频功率1限制 |
Power Limit 1 |
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长时睿频功耗,CPU在长时间负载时,基本最后都会停留到这个功耗,基本为一台笔记本CPU实际上的TDP |
Power Limit 1 Time Window |
0x54A |
0x80 |
Maximum |
超频最长时间 |
Power Limit 2 Override |
0x501 |
0x1 |
Enabled |
无视超频功率2限制 |
Power Limit 2 |
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短时睿频功耗,通常会高过PL1许多,是在短时间负载内CPU能够达到的最高功耗,基本为一台笔记本的CPU性能上限 |
1-Core Ratio Limit Override |
0x5D1 |
0x53 |
Maximum |
单核工作时超频至最高 |
2-Core Ratio Limit Override |
0x5D2 |
0x53 |
Maximum |
单核工作时超频至最高 |
3-Core Ratio Limit Override |
0x5D3 |
0x53 |
Maximum |
单核工作时超频至最高 |
4-Core Ratio Limit Override |
0x5D4 |
0x53 |
Maximum |
单核工作时超频至最高 |
5-Core Ratio Limit Override |
0x6D3 |
0x53 |
Maximum |
单核工作时超频至最高 |
6-Core Ratio Limit Override |
0x6D4 |
0x53 |
Maximum |
单核工作时超频至最高 |
7-Core Ratio Limit Override |
0x6D5 |
0x53 |
Maximum |
单核工作时超频至最高 |
8-Core Ratio Limit Override |
0x6D6 |
0x53 |
Maximum |
单核工作时超频至最高 |
Energy Efficient Turbo |
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节能睿频模式,将适时降低涡轮频率,以提高能源效率 |
CPU VR Settings |
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PSYS Slope |
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PSYS Slope基本为IMON slope,以1/100的增量定义,并使用BIOS VR mailbox 0x9指令。有效范围为0-200,输入125表示斜率为1.25,输入0表示自动 |
PSYS Offset |
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PSYS偏移量以1/4的增量定义,并使用BIOS VR mailbox 0x9指令。有效范围为0-255,输入100表示偏移量为25 |
PSYS PMax Power |
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该值以1/8瓦特为单位定义,并使用BIOS VR mailbox 0xB指令。有效范围为0-8192,输入1000表示PMax值为125瓦,输入0表示自动 |
VR Mailbox Command options |
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VR mailbox发送的指令,1表示MPS VR cmd,2表示PS4 Exit VR cmd,4表示MPS VR Decay cmd。输入要使用的命令的和,如5表示1+4 |
Acoustic Noise Settings |
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Acoustic Noise Mitigation |
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当CPU处于更深的C-States时,开启该选项可以帮助减轻某些SKU上的噪音 |
Disable Fast PKG C State Ramp for IA/GT/SA Domain |
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选择False以在更深层次的C-States中启用快速Ramp |
Slow Slew Rate for IA/GT/SA Domain |
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设置VR IA慢转换速率的深层C-States Ramp时间,用于帮助减少声噪声。慢转换速率等于快转换速率除以数字2/4/8/16 |
Core/IA VR Settings |
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VR Config Enable |
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Enabled |
/ |
AC Loadline |
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AC负载线,定义为1/100 mOhms,使用BIOS VR mailbox 0x2指令。有效范围为0-6249(0-62.49mOhms),输入1255表示12.55mOhm,输入0表示自动 |
DC Loadline |
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DC负载线,定义为1/100 mOhms,使用BIOS VR mailbox 0x2指令。有效范围为0-6249(0-62.49mOhms),输入1255表示12.55mOhm,输入0表示自动 |
PS Current Threshold1 |
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120 |
PS当前阈值1以1/4A增量定义,使用BIOS VR mailbox 0x3指令。有效范围为0-512(0-128A),输入400表示10A,输入0表示自动。默认为80(20A) |
PS Current Threshold2 |
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40 |
PS当前阈值1以1/4A增量定义,使用BIOS VR mailbox 0x3指令。有效范围为0-512(0-128A),输入400表示10A,输入0表示自动。默认为20(5A) |
PS Current Threshold3 |
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0 |
PS当前阈值1以1/4A增量定义,使用BIOS VR mailbox 0x3指令。有效范围为0-512(0-128A),输入400表示10A,输入0表示自动。默认为4(1A) |
PS3 Enable |
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使用BIOS VR mailbox 0x3指令 |
PS4 Enable |
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使用BIOS VR mailbox 0x3指令 |
IMON Slope |
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IMON(Load Current Monitor)Slope以1/100增量定义,使用BIOS VR mailbox 0x4指令,CPU真实功率乘以该倍率后报给EC控制。有效范围为0-200,输入125表示倍率为1.25,输入0表示自动。如输入80,则20W限制的CPU在上报时仅为16W,EC会继续控制该CPU达到25W,但认为该CPU当前功率仅为20W(25*0.8=20) |
IMON Offset |
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IMON偏移量以1/1000的增量定义,使用BIOS VR mailbox 0x4指令。有效范围为0-63999,输入25348表示偏移量为25.348。调整会影响电池模式消耗 |
IMON Prefix |
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设置IMON偏移值为正数或负数 |
VR Current Limit |
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400 |
设置电压调节器的电流限制(允许的最大瞬时电流),以1/4A为单位递增,使用BIOS VR mailbox 0x6指令。输入400表示100A,输入0表示自动 |
VR Voltage Limit |
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1100 |
设置电压调节器的电压限制,使用BIOS VR mailbox 0x6指令。输入1250表示1.25V,输入0表示自动 |
TDC Enable |
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TDC(Thermal Design Current) |
TDC Current Limit |
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TDC电流限制以1/8A增量定义,使用BIOS VR mailbox 0x1A指令。有效范围是0-32767,输入1000表示125A,输入0表示0A |
TDC Time Window |
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TDC时间窗口以毫秒为单位定义。选项有1ms/2ms/3ms/4ms/5ms/6ms/7ms/8ms/10ms(9ms在MSR定义中没有有效的编码) |
TDC Lock |
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TDC锁 |
Power Limit 3 Settings |
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Power Limit 3 Override |
0x506 |
0x1 |
Enabled |
无视超频功率3限制 |
Power Limit 3 |
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超过这个阈值,PL3快速功率限制算法将试图通过被动限制频率来限制高于PL3的峰值的占空比 |
Power Limit 3 Time Window |
0x50B |
0x40 |
Maximum |
超频最长时间 |
Power Limit 3 Duty Cycle |
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/ |
Power Limit 3 Lock |
0x50D |
0x0 |
Disabled |
Platform 3功耗限制锁 |
Config TDP Configurations |
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Configurable TDP Boot Mode |
0x528 |
0x2 |
Up |
TDP驱动模式 |
Configurable TDP Lock |
0x529 |
0x0 |
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TDP锁 |
CTDP BIOS control |
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通过运行时ACPI BIOS方法开启CTDP控制 |
Custom Settings Down |
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Power Limit 1 |
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设置Package Power Limit 1,以毫瓦为单位。当超过这个限制时,CPU比率会在一段时间后降低。设置较低的阈值可以节约功耗和保护CPU,设置较高的阈值可以提高性能。设为0时由BIOS设置,默认设置取决于CPU |
Power Limit 2 |
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设置Package Power Limit 2,以毫瓦为单位。当超过这个限制时,CPU比率会在一段时间后降低。设置较低的阈值可以节约功耗和保护CPU,设置较高的阈值可以提高性能。设为0时由BIOS设置,默认设置取决于CPU |
Power Limit 1 Time Window |
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TDP值被维护的时间窗口的长度,有效范围为0-128,默认值为8 |
ConfigTDP Turbo Activation Ratio |
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Turbo激活比的自定义值。默认值是0,表示不使用自定义值 |
View/Configure CPU Lock Options |
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CFG Lock |
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关闭或开启MSR 0xe2寄存器,CPU的P-State/C-State电源管理是放在MSR寄存器里的(用黑苹果时候须解锁) |
Overclocking Lock |
0x5D6 |
0x0 |
Disabled |
超频锁 |
GT - Power Management Control |
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RC6(Render Standby) |
0x740 |
0x1 |
Enabled |
集成显卡待机 |
Maximum GT frequency |
0x752 |
0xFF |
Default Max Frequency |
显卡最大频率 |
PCH-FW Configuration |
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ME State |
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/ |
Manageability Features State |
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启用/禁用Intel Active Management Technology BIOS扩展,注意iAMT H/W总是启用,这个选项只控制BIOS扩展的执行。如果启用,则需要在SPI中添加额外的固件 |
AMT BIOS Features |
0x6F1 |
0x1 |
Enabled |
/ |
ME Unconfig on RTC Clear |
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禁用时,ME将不会在RT重置时取消配置 |
NFC Feature State |
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Disabled |
指定一个NFC模块,或None表示禁用 |
Comms Hub Support |
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/ |
JHI Support |
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/ |
Core Bios Done Message |
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/ |
PTT Configuration |
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TPM Device Selection |
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TPM设备选择 |
PTP aware OS |
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/ |
TPM 1.2 Deactivate |
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|
TPM(Trusted Platform Module)1.2撤销 |
Firmware Update Configuration |
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Me FW Image Re-Flash |
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|
BIOS升降级功能 |
ME Debug Configuration |
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HECI Timeouts |
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|
|
HECI收/发超时时间 |
Force ME DID Init Status |
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强制DID初始化状态值 |
CPU Replaced Polling Disable |
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|
|
禁用CPU更换轮询循环 |
ME DID Message |
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|
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启用/禁用ME DID消息 |
HECI Retry Disable |
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|
|
禁用所有HECI API的重试机制 |
HECI Message check Disable |
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|
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在发送消息时,禁止对BIOS引导路径进行消息检查 |
MBP HOB Skip |
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/ |
KT Device |
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|
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KT设备 |
IDER Device |
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|
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IDER设备 |
End Of Post Message |
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|
|
启用/禁用发送给ME的结束信息 |
D0I3 Setting for HECI Disable |
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|
|
禁止为所有HECI设备设置DOI3位 |
AMT Configuration |
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ASF support |
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启用/禁用警报规格格式ASF(Alert Specification Format) |
USB Provisioning of AMT |
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开启/关闭USB发放功能 |
CIRA Configuration |
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CIRA Timeout |
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为要建立的CIRA连接设置超时选项。可用范围为1-254秒,输入000表示将60秒作为缺省的超时值,输入255表示不限制等待建立连接的时间 |
ASF Configuration |
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PET Progress |
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启用/禁用PET进程 |
WatchDog |
|
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Enabled |
看门狗计时器 |
OS Timer |
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/ |
BIOS Timer |
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/ |
Secure Erase Configuration |
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Secure Erase mode |
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安全擦除模式 |
Force Secure Erase |
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强制安全擦除 |
MEBx Resolution Settings |
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Non-UI Mode Resolution |
|
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Auto |
MEBx对MEBx用户界面外的消息使用的文本模式分辨率 |
UI Mode Resolution |
|
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Auto |
MEBx使用的文本模式分辨率 |
Graphics Mode Resolution |
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Auto |
MEBx使用的图形模式分辨率 |
Cpu Thermal Configuration |
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DTS SMM |
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开启CPU数字热传感器功能(DTS,Digital Thermal Sensor) |
Tcc Offset Clamp Enable |
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/ |
Tcc Offset Lock Enable |
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|
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开启温度墙调整锁 |
Bi-directional PROCHOT# |
0x561 |
0x0 |
Disabled |
PROCHOT#用于温度高时强制降频,开启该选项将使外部代理可驱动PROCHOT#以控制处理器 |
Disable PROCHOT# Output |
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/ |
Disable VR Thermal Alert |
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/ |
PROCHOT Response |
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Disabled |
/ |
PROCHOT Lock |
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温度墙锁 |
PECI Reset |
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|
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PECI重置 |
PECI C10 Reset |
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|
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PECI C10重置 |
Platform Thermal Configuration |
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Automatic Thermal Reporting |
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根据BWG热管理设置报告中推荐的值自动配置_CRT 、_PSV 、_AC0 |
Critical Trip Point |
0x2B2 |
0x7F |
127 C |
系统关闭的温度 |
Active Trip Point 0 |
|
|
|
操作系统在到达Active Trip Point 0的温度后,将把处理器风扇转速设置为Active Trip Point 0 Fan Speed。取值范围15/23/31/39/47/55/63/71/79/87/95/100/111/127C,默认值为71C |
Active Trip Point 0 Fan Speed |
|
|
|
操作系统在到达Active Trip Point 0的温度后,将把处理器风扇转速设置为Active Trip Point 0 Fan Speed。取值为0-100,0为风扇关闭,100为最大转速 |
Active Trip Point 1 |
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|
|
操作系统在到达Active Trip Point 1的温度后,将把处理器风扇转速设置为Active Trip Point 1 Fan Speed。取值范围15/23/31/39/47/63/71/79/87/95/100/103/111/119(POR)/127C,默认值为55C |
Active Trip Point 1 Fan Speed |
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|
|
操作系统在到达Active Trip Point 1的温度后,将把处理器风扇转速设置为Active Trip Point 1 Fan Speed。取值为0-100,0为风扇关闭,100为最大转速,默认值为75。该值必须小于Active Trip Point 0 Fan Speed |
Passive Trip Point |
0x2B1 |
0x77 |
119 C (POR) |
CPU被动降温点 |
Passive TC1 Value |
|
|
|
设置ACPI被动冷却公式的TC1值,取值范围为1-16 |
Passive TC2 Value |
|
|
|
设置ACPI被动冷却公式的TC2值,取值范围为1-16 |
Passive TSP Value |
|
|
|
ACPI被动冷却公式的TSP值,表示在启用被动冷却时操作系统读取温度的频率,单位为秒 |
Active Trip Points |
|
|
|
/ |
Passive Trip Points |
0x2B7 |
0x1 |
Enabled |
打开Passive Trip |
Critical Trip Points |
0x2B8 |
0x1 |
Enabled |
设置操作系统关闭的温度阈值。_HOT 对象声明OSPM可以选择将系统转换到S4休眠状态的临界温度(如果支持),_CRT 对象声明OSPM必须执行紧急关机的临界温度 |
PCH Thermal Device |
|
|
|
/ |
PCH Temp Read |
|
|
|
/ |
CPU Energy Read |
|
|
|
/ |
CPU Temp Read |
|
|
|
/ |
Alert Enable Lock |
|
|
|
/ |
DPTF Configuration |
|
|
|
|
DPTF |
0x2C5 |
0x0 |
Disabled |
动态平台和热框架DPTF(Dynamic Platform and Thermal Framework)会在高温下启动,也会被显卡状态、供电模块温度等触发 |
DPTF Configuration |
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|
|
/ |
Processor Thermal Device |
|
|
|
/ |
Active Thermal Trip Point |
|
|
|
控制ACPI Active Thermal Trip Point的温度。取值范围为0-127,默认值为90,0表示禁用 |
Passive Thermal Trip Point |
|
|
|
控制ACPI Passive Thermal Trip Point的温度。取值范围为0-127,默认值为100,0表示禁用 |
Critical Thermal Trip Point |
|
|
|
控制ACPI Critical Thermal Trip Point的温度。取值范围为0-127,默认值为105,0表示禁用 |
S3/CS Thermal Trip Point |
|
|
|
控制ACPI S3/CS Thermal Trip Point的温度。取值范围为0-127,默认值为110,0表示禁用 |
Hot Thermal Trip Point |
|
|
|
控制ACPI Hot Thermal Trip Point的温度。取值范围为0-127,默认值为105,0表示禁用 |
Thermal Sampling Period |
|
|
|
轮询间隔,以1/10秒为单位。取值范围为0-100,默认值为0,表示让驱动程序使用中断。采样周期粒度为0.1秒,若采样周期是30秒,那么_TSP需要为300秒 |
PPCC Step Size |
|
|
|
/ |
Minimum Power Limit 0-2 |
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|
|
/ |
CLPO Enable |
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|
|
/ |
CLPO Start PState |
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|
/ |
CLPO Step Size |
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|
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/ |
CLPO Power Control |
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|
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/ |
CLPO Performance Control |
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|
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/ |
ConfigTDP |
|
|
|
/ |
LPM |
|
|
|
支持LPM(link power management)以获得更好的省电效果 |
Policy Configuration |
|
|
|
|
Active Policy |
|
|
|
启用/禁用激活策略算法,该算法通过散热而非限制功率来冷却设备 |
Passive Policy |
|
|
|
设置被动策略,该策略负责限制功率和组件性能 |
TRT Revision |
|
|
|
设置热关系表(TRT),通知操作系统每个设备对每个热区的相对热贡献 |
Critical Policy |
|
|
|
启用/禁用关键策略。在平台达到临界温度的情况下,临界策略负责关闭系统 |
Cooling Mode Policy |
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|
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/ |
Platform Noise Mitigation |
|
|
|
/ |
Power Boss |
|
|
|
/ |
Hardware Duty Cycling |
|
|
|
HDC(Hardware Duty cycle)让CPU自动进入空闲状态 |
Adaptive Performance |
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/ |
Virtual Sensor |
|
|
|
虚拟传感器 |
PID Policy |
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|
/ |
Design Variable 0-5 |
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/ |
PPCC Object |
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/ |
PDRT Object |
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/ |
ARTG Object |
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/ |
PMAX Object |
|
|
|
|
_TMP 1-8 Object |
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/ |
Platform Settings |
|
|
|
|
Firmware Configuration |
|
|
|
固件配置 |
PS2 Keyboard and Mouse |
|
|
|
PS2键盘和鼠标 |
Pmic Vcc IO Level |
|
|
|
/ |
Pmic Vddq Level |
|
|
|
/ |
HEBC value |
|
|
|
/ |
SLP_S0# Voltage Margining |
|
|
|
/ |
Audio Connector |
|
|
|
音频连接器 |
Enable EInk DFU device |
|
|
|
/ |
Power Sharing Manager |
|
|
|
电源共享管理器 |
Domain Type SPLC 1 |
|
|
|
/ |
Default Power Limit 1 SPLC |
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/ |
Default Time Window 1 SPLC |
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/ |
Domain Type SPLC 2 |
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/ |
Default Power Limit 2 SPLC |
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/ |
Default Time Window 2 SPLC |
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/ |
Domain Type DPLC 1 |
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/ |
Domain Preference DPLC 1 |
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/ |
Power Limit Index 1 DPLC |
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/ |
Default Power Limit 1 DPLC |
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/ |
Default Time Window 1 DPLC |
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/ |
Minimum Power Limit 1 DPLC |
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/ |
Maximum Power Limit 1 DPLC |
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/ |
Maximum Time Window 1 DPLC |
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/ |
Domain Type DPLC 2 |
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/ |
Domain Preference DPLC 2 |
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/ |
Power Limit Index 2 DPLC |
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/ |
Default Power Limit 2 DPLC |
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/ |
Default Time Window 2 DPLC |
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/ |
Minimum Power Limit 2 DPLC |
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/ |
Maximum Power Limit 2 DPLC |
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/ |
Default Time Window 2 SPLC |
|
|
|
/ |
Wireless device |
|
|
|
无线设备 |
Domain Type SPLC 1-3 |
|
|
|
/ |
Default Power Limit |
|
|
|
默认功率限制 |
Default Time Window |
|
|
|
默认时间窗口大小 |
TRxDelay_A |
|
|
|
/ |
TRxCableLength_A |
|
|
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/ |
TRxDelay_B |
|
|
|
/ |
TRxCableLength_B |
|
|
|
/ |
Domain Type |
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|
|
域名类型 |
Country Identifier |
|
|
|
国家代号 |
Realsense 3D Camera Settings |
|
|
|
|
RTD3 Camera Support |
|
|
|
RTD3相机支持 |
Select Camera |
|
|
|
选择相机 |
Delay needed for Ivcam power on |
|
|
|
Ivcam相机打开时需要延迟 |
Delay needed for Ivcam power off |
|
|
|
Ivcam相机关闭时需要延迟 |
Rotation |
|
|
|
旋转 |
DFU support |
|
|
|
DFU支持 |
Wake support |
|
|
|
唤醒支持 |
Delay needed for DS camera power on |
|
|
|
DS相机打开时需要延迟 |
Delay needed for DS camera power off |
|
|
|
DS相机打开时需要延迟 |
Rotation |
|
|
|
旋转 |
OverClocking Performance Menu |
|
|
|
|
OverClocking Feature |
0x696 |
0x1 |
Enabled |
超频特性 |
WDT Enable |
|
|
|
看门狗定时器 |
XTU Interface |
|
|
|
XTU界面 |
BCLK Aware Adaptive Voltage |
|
|
|
外频/电压比率调整,启用时CPU会计算外频与电压之间的比率,通常适用于外频超频而防止电压过高 |
Processor |
|
|
|
|
Core Max OC Ratio |
|
|
|
内核最大OC倍频 |
Core Voltage Mode |
|
|
|
CPU核心电压模式 |
Core Voltage Override |
|
|
|
CPU核心电压固定值 |
Core Extra Turbo Voltage |
|
|
|
CPU核心电压睿频固定值 |
Core Voltage Offset |
|
|
|
加压/减压 |
Offset Prefix |
|
|
- |
偏移量正负 |
Ring Down Bin |
|
|
|
AUTO时会降低超频后满载时的缓存频率,超缓存时需要关闭 |
Ring Max OC Ratio |
|
|
|
设置CPU Ring的最大超频比率 |
Ring Min OC Ratio |
|
|
|
设置CPU Ring的最小超频比率 |
AVX Ratio Offset |
0x6A1 |
0x3 |
3 |
AVX倍频补偿,可以大幅度提高超频稳定性,建议设置在3。设置在1可以让CPU在浮点运算的时候比整数低100Mhz,若CPU一般情况下跑在4.5Ghz,那么在跑AVX指令集时就会降低到4.4Ghz,如果设置为3就会降低300Mhz。适当降低AVX频率有助于超频成功率的提升 |
GT |
|
|
|
|
GT OverClocking Frequency |
|
|
|
核显超频频率 |
GT Voltage Mode |
|
|
|
核显电压模式 |
GT Voltage Override |
|
|
|
核显电压固定值 |
GT Extra Turbo Voltage |
|
|
|
核显电压睿频固定值 |
GT Voltage Offset |
|
|
|
核显电压偏移值 |
Offset Prefix |
|
|
|
偏移量正负 |
Uncore |
|
|
|
|
Uncore Voltage Offset |
|
|
|
/ |
Offset Prefix |
|
|
|
偏移量正负 |
Memory Overclocking Menu |
|
|
|
|
Realtime Memory Timing |
|
|
|
在BIOS阶段之后调整内存计时 |
Memory profile |
|
|
|
内存配置文件 |
Memory Reference Clock |
|
|
|
内存参考源时钟,通常可以设置为Auto。内存频率是按照与CPU外频和Home Agent的比率来实现的,100Mhz可以实现DDR 3000、3100等频率,133Mhz可以实现DDR 3333等频率 |
Memory Ratio |
|
|
|
内存频率 |
QCLK Odd Ratio |
|
|
|
间隔频率 |
tCL |
|
|
|
/ |
tRCD/tRP |
|
|
|
tRCD(RAS to CAS Delay)为内存行地址传输到列地址的延迟时间,tRP(RAS Precharge Time)为内存行地址选通脉冲预充电时间 |
tRAS |
|
|
|
/ |
tCWL |
|
|
|
/ |
tFAW |
|
|
|
/ |
tREFI |
|
|
|
/ |
tRFC |
|
|
|
/ |
tRRD |
|
|
|
/ |
tRTP |
|
|
|
/ |
tWR |
|
|
|
/ |
tWTR |
|
|
|
/ |
NMode |
|
|
|
/ |
Memory Voltage |
|
|
|
内存电压 |
DllBwEn[0]-[3] |
|
|
|
设置DllBwEn值 |
Voltage PLL Trim Controls |
|
|
|
|
Core PLL Voltage Offset |
|
|
|
设置CPU锁相环电压偏移值,用于在极端超频条件下增加核心频率的范围,以15mV为单位。取值范围为0-63,输入0以使用出厂默认值 |
GT PLL Voltage Offset |
|
|
|
核心显卡锁相环电压偏移量 |
Ring PLL Voltage Offset |
|
|
|
环形总线锁相环电压 |
System Agent PLL Voltage Offset |
|
|
|
Home Agent锁相环电压 |
Memory Controller PLL Voltage Offset |
|
|
|
内存控制器锁相环电压 |
Intel ICC |
|
|
|
|
ICC/OC Watchdog Timer |
|
|
|
ICC/OC监视时钟设置 |
ICC Locks after EOP |
|
|
|
/ |
ICC Profile |
|
|
|
ICC色彩特性文件 |
ICC PLL Shutdown |
|
|
|
/ |
DMI CLOCK placeholder for clock 2/3 title |
|
|
|
|
Clock Frequency |
|
|
|
时钟频率 |
Bclk Change Type |
|
|
|
/ |
Spread % |
|
|
|
/ |
Trusted Computing |
|
|
|
|
Security Device Support |
|
|
|
安全保护设备支持 |
SHA-1 PCR Bank |
|
|
|
/ |
SHA256 PCR Bank |
|
|
|
/ |
SHA384 PCR Bank |
|
|
|
/ |
SHA512 PCR Bank |
|
|
|
/ |
SM3_256 PCR Bank |
|
|
|
/ |
TPM State |
|
|
|
TPM状态 |
Pending operation |
|
|
|
计划安全设备的操作 |
Platform Hierarchy |
|
|
|
平台层次结构 |
Storage Hierarchy |
|
|
|
存储层次结构 |
Endorsement Hierarchy |
|
|
|
支持层级结构 |
TPM2.0 UEFI Spec Version |
|
|
|
TCG2规范版本支持。TCG_1_2为Win8/Win10兼容模式,TCG_2为支持新的TCG2协议和Win10或更高版本的事件格式 |
Physical Presence Spec Version |
|
|
|
选择告诉操作系统支持的PPI规范版本(1.2或1.3)。部分HCK测试可能不支持1.3 |
TPM 20 InterfaceType |
|
|
|
TPM 20交互模式 |
Device Select |
|
|
|
选择设备 |
ACPI Settings |
|
|
|
|
Enable ACPI Auto Configuration |
|
|
|
开启ACPI自动配置 |
Enable Hibernation |
|
|
|
开启休眠 |
ACPI Sleep State |
|
|
|
ACPI睡眠状态 |
Lock Legacy Resources |
|
|
|
锁定旧版资源 |
S3 Video Repost |
|
|
|
/ |
Intel Bios Guard Support |
|
|
|
|
Intel Bios Guard Support |
|
|
|
/ |
AMI Graphic Output Protocol Policy |
|
|
|
|
Output Select |
|
|
|
选择输出 |
Brightness Setting |
|
|
|
亮度调整 |
BIST Enable |
|
|
|
内建自检 |
Network Stack Configuration |
|
|
|
|
Network Stack |
|
|
|
UEFI网络堆栈功能 |
Ipv4 PXE Support |
|
|
|
Ipv4 PXE启动项支持 |
Ipv4 HTTP Support |
|
|
|
Ipv4 HTTP启动项支持 |
Ipv6 PXE Support |
|
|
|
Ipv6 PXE启动项支持 |
Ipv6 HTTP Support |
|
|
|
Ipv6 HTTP启动项支持 |
IP6 Configuration Policy |
|
|
|
/ |
PXE boot wait time |
|
|
|
PXE启动的等待时间 |
Media detect count |
|
|
|
侦测媒体数量 |
CSM Configuration |
|
|
|
|
CSM Support |
|
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兼容性支持模块(CSM)是UEFI固件的一个组件,它通过模拟BIOS环境提供传统BIOS兼容性,允许传统操作系统和一些不支持UEFI的选项ROM继续使用 |
GateA20 Active |
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设置GateA20的动作模式 |
Option ROM Messages |
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[Force BIOS]选购设备固件程序会在开机显示,[Keep Current]开箱时只显示ASUS标志 |
INT19 Trap Response |
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对INT19陷阱的反馈 |
Boot option filter |
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选择Legacy/UEFI启动方式 |
Network |
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网络 |
Storage |
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存储 |
Video |
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视频 |
Other PCI devices |
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其余PCI设备 |
SDIO Configuration |
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SDIO Access Mode |
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Switchable Graphics |
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SG Mode Select |
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USB Configuration |
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USB Support |
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USB支持 |
Legacy USB Support |
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传统USB支持 |
USB 2.0 Controller Mode |
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USB 2.0控制器模式 |
XHCI Legacy Support |
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传统XHCI支持 |
XHCI Hand-off |
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让操作系统接管XHCI控制器 |
EHCI Hand-off |
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让操作系统接管EHCI控制器 |
USB Mass Storage Driver Support |
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大容量USB驱动支持 |
Port 60/64 Emulation |
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60/64端口模拟 |
USB transfer time-out |
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USB传输超时 |
Device reset time-out |
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设备重置超时 |
Device power-up delay |
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设备开启延迟 |
Device power-up delay in seconds |
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设备开启延迟(以秒为单位) |
Demo Board |
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CRB Test |
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System Agent (SA) Configuration |
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Stop Grant Configuration |
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停止许可配置 |
Number of Stop Grant Cycles |
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停止许可循环的次数 |
VT-d |
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开启或关闭CPU的I/O虚拟化功能 |
CHAP Device (B0:D7:F0) |
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启用/禁用SA CHAP设备 |
Thermal Device (B0:D4:F0) |
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启用/禁用SA Thermal设备 |
GMM Device (B0:D8:F0) |
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启用/禁用SA GMM设备 |
CRID Support |
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启用兼容的修订ID(Compatible Revision ID) |
Above 4GB MMIO BIOS assignment |
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Enabled |
4G以上内存映射的IO BIOS分配 |
X2APIC Opt Out |
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防止操作系统启用扩展xAPIC(x2APIC)模式 |
SKY CAM Device (B0:D5:F0) |
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启用/禁用SA SKY CAM设备 |
eDRAM Mode |
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嵌入式DRAM(Embedded DRAM)模式 |
Graphics Configuration |
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Graphics Turbo IMON Current |
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图形Turbo IMON当前值,取值范围为14-31 |
Skip Scaning of External Gfx Card |
0x8AE |
0x0 |
Disabled |
跳过外部显卡扫描 |
Primary Display |
0x80D |
0x4 |
SG |
不同显示类型的优先级。Auto为自动选择显示类型,IGFX为从主板上的核心显卡输出端口输出视频,PEG为从CPU上的PCIe插槽输出视频,PCI为从南桥上的PCIe插槽输出视频,SG为自动切换(此模式两种显示都会保留) |
Select PCIE Card |
0x80E |
0x2 |
Auto |
选择PCIE卡 |
SG Delay After Power Enable |
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SG模式在开机后的时延(毫秒) |
SG Delay After Hold Reset |
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SG模式在重启后的时延(毫秒) |
Internal Graphics |
0x813 |
0x2 |
Auto |
设置内部集成显卡显示 |
GTT Size |
0x74A |
0x3 |
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IGD的Gtt内存大小 |
Aperture Size |
0x74B |
0x1 |
256MB |
显示数据处理的临时缓冲区大小 |
DVMT Pre-Allocated |
0x7E8 |
0x2 |
64M |
动态共享显存预设值 |
DVMT Total Gfx Mem |
0x7E9 |
0x2 |
256M |
设置动态共享显存分配最大值。取值范围为128M/256M/MAX,默认为256M。MAX值与驱动及操作系统有关,在windows操作系统下,为主板内存的一半。由于集显本身是没有内存的,所以需要共享主板的内存。当GPU不再需要占用这些内存资源时,会自动归还给系统内存,将其返还操作系统供其它应用程序或系统功能使用 |
Intel Graphics Pei Display Peim |
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早期PEI阶段显示控制开关 |
Gfx Low Power Mode |
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仅适用于SFF |
ALS Support |
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仅适用于ACPI。Legacy为ALS通过IGD INT10功能支持,ACPI为ALS通过ACPI ALS驱动支持 |
VDD Enable |
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/ |
PM Support |
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电源管理控制开关 |
PAVP Enable |
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Intel智能音频技术 |
Cdynmax Clamping Enable |
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激活Cdynmas Clamping |
Cd Clock Frequency |
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/ |
IUER Button Enable |
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IUER按钮功能 |
LCD Control |
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Primary IGFX Boot Display |
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在POST期间激活的主视频设备 |
Secondary IGFX Boot Display |
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在POST期间激活的副视频设备 |
LCD Panel Type |
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LCD面板类型 |
Panel Scaling |
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面板等级 |
Backlight Control |
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背光控制 |
Active LFP |
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/ |
Backlight Brightness |
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背光亮度 |
Intel(R) Ultrabook Event Support |
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IUER Slate Enable |
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/ |
Slate Mode boot value |
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/ |
Slate Mode on S3 and S4 resume |
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IUER Dock Enable |
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/ |
Dock Mode boot value |
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Dock Mode upon S3 and S4 resume |
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External Gfx Card Primary Display Configuration |
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Primary PEG |
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主PEG |
Primary PCIE |
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主PCIE |
DMI/OPI Configuration |
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DMI Max Link Speed |
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设置DMI速度 |
DMI Vc1 Control |
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DMI 1虚拟通道控制 |
DMI Vcm Control |
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DMI虚拟通道M控制 |
Program Static Phase1 Eq |
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DMI Link ASPM Control |
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设置DMI Link上北桥与南桥的ASPM(Active State Power Management)功能 |
DMI Extended Sync Control |
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DMI扩展同步只能在调试或测试环境中使用,并且在启用L0s时可能导致锁定 |
DMI De-emphasis Control |
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DMI减重控制 |
DMI IOT |
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/ |
Lane 0-3 |
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Gen3 RxCTLE Control |
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Bundle0/1 |
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PEG 0:1:0 |
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PEG 0:1:1 |
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PEG 0:1:2 |
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Enable Root Port |
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开启根端口 |
Max Link Speed |
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最大链路速度 |
Max Link Width |
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最大链路带宽 |
Power Down Unused Lanes |
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关闭未使用的链路 |
Gen3 Eq Phase 2 |
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Gen3 Eq Phase 3 Method |
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ASPM |
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ASPM(Active State Power Management)让PCIe SSD在某种情况下,能够从工作模式(D0 state)通过把自身PCIe链路切换到低功耗模式,并且通知对方也这样做,从而达到降低整条链路功耗的目的 |
ASPM L0s |
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De-emphasis Control |
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取消PEG的控制 |
OBFF |
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OBFF(Optimized Buffer Flush/Fill mechanism in PC technology)启用时,主机软件能够将系统状态传输至具有主线总控能力的下游装置,通过它们优化传输排程,并使系统在节能模式下工作的时间更长 |
LTR |
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PEG0 Slot Power Limit Value |
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PEG0插槽电源限定值 |
PEG0 Slot Power Limit Scale |
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Slot Power Limit Value倍率 |
PEG0 Physical Slot Number |
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PEG0物理插槽编号 |
PEG0 Hotplug |
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PEG0热插拔 |
PEG Port Configuration |
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PEG0/PEG1/PEG2 Max Payload size |
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设定PEG0/PEG1/PEG2最大覆载量 |
Program PCIe ASPM after OpROM |
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编程PCIe ASPM的时间 |
Program Static Phase1 Eq |
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/ |
Always Attempt SW EQ |
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总是尝试SW EQ |
Number of Presets to test |
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/ |
Allow PERST# GPIO Usage |
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启用/禁用基于GPIO的重置 |
SW EQ Enable VOC |
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/ |
Jitter Dwell Time |
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Jitter Error Target |
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VOC Dwell Time |
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VOC存在时间 |
VOC Error Target |
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VOC错误目标 |
Generate BDAT PEG Margin Data |
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生成BDAT PEG边缘数据 |
PCIe Rx CEM Test Mode |
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/ |
PEG Lane number for Test |
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/ |
Non-Protocol Awareness |
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PCIe Spread Spectrum Clocking |
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启用PCIe时钟芯片扩频功能 |
Gen3 Root Port Preset |
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根端口Gen3均衡的预设值,取值范围为1-11 |
Gen3 Endpoint Preset |
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Gen3均衡的端点预设值,取值范围为0-10 |
Gen3 Endpoint Hint |
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Gen3均衡的端点提示值,取值范围为0-10 |
Lane 0-15 |
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PEG Gen3 RxCTLE Control |
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PEG Gen3 RxCTLE for Bundle0(Lane0, Lane1),取值范围0-255 |
Bundle0-7 |
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Gen3 RxCTLE setting for Bundle0 (Lane0, Lane1)/ Bundle1 (Lane2, Lane3)/ … / Bundle7 (Lane14, Lane15) |
RxCTLE Override |
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启用时它将覆盖PEG的RxCTLE自适应行为 |
PEG Port Feature Configuration |
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Detect Non-Compliance Device |
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检测不兼容设备 |
PCH-IO Configuration |
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DCI enable (HDCIEN) |
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USB/UART |
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Debug Port Selection |
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调试端口选择 |
GNSS |
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北斗 |
GNSS Device Model |
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北斗设备型号 |
PCH LAN Controller |
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PCH LAN控制器 |
Sensor Hub Type |
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传感器坞类型 |
DeepSx Power Policies |
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深度睡眠状态下的电源管理策略 |
LAN Wake From DeepSx |
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Wake on LAN Enable |
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在Moff时启用PCH内部局域网唤醒 |
SLP_LAN# Low on DC Power |
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当主机WoL和可管理性硬件被禁用时,本选项可以用来关闭不需要打开的电源轨 |
K1 off |
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启用/禁用K1 off特性(CLKREQ) |
Wake on WLAN and BT Enable |
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开启/关闭PCI Express无线局域网和蓝牙以唤醒系统 |
DeepSx Wake on WLAN and BT Enable |
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开启/关闭PCI Express无线局域网和蓝牙,使系统从DeepSx唤醒 |
Disable DSX ACPRESENT PullDown |
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在DeepSX或G3退出时启动或关闭PCH internal ACPRESENT |
CLKRUN# logic |
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开启或关闭CLKRUN#逻辑以停止PCI时脉 |
Serial IRQ Mode |
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串行IRQ模式。选择Quit为需要时才激活,选择Continuous为一直激活 |
Port 61h Bit-4 Emulation |
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61h端口的4 bit模拟 |
High Precision Timer |
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高精度计时器 |
State After G3 |
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指定在电源故障后重新应用电源时切换到什么状态 |
Port 80h Redirection |
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80h端口重定向 |
Enhance Port 80h LPC Decoding |
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80h端口的LPC解码增强 |
Compatible Revision ID |
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兼容的修改ID |
PCH Cross Throttling |
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/ |
Disable Energy Reporting |
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禁止电能报告 |
Enable TCO Timer |
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开启TCO计时器 |
Pcie Pll SSC |
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/ |
IOAPIC 24-119 Entries |
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IRQ24-119硬件中断性访问入口,建议保持开启以提升芯片组的响应速度 |
Unlock PCH P2SB |
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/ |
PMC READ DISABLE |
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禁止对PMC的读操作 |
Flash Protection Range Registers (FPRR) |
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SPD Write Disable |
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/ |
ChipsetInit HECI Message |
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Bypass ChipsetInit sync reset |
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/ |
PCI Express Configuration |
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PCI Express Clock Gating |
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PCI Express根端口时钟门控 |
Legacy IO Low Latency |
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DMI Link ASPM Control |
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DMI链路的有源状态控制电源管理 |
Port8xh Decode |
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/ |
Port8xh Decode Port# |
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/ |
Peer Memory Write Enable |
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/ |
PCIe-USB Glitch W/A |
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连接到PCIE/PEG接口背后的,对于不良USB设备的PCIe-USB glitch W/A |
PCIe function swap |
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/ |
PCI Express Gen3 Eq Lanes |
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PCIE1-20 Cm |
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PCIE1-20 Cp |
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Override SW EQ settings |
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Coeff0-4 Cm |
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Coeff0-4 Cp |
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/ |
PCI Express Root Port 1-24 |
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PCI Express Root Port 1-24 |
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Enabled |
控制PCI Express根端口 |
Topology |
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/ |
ASPM |
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控制PCIe Active State电源管理设置(ASPM,Active State Power Management) |
L1 Substates |
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PCI Express L1子状态设置 |
Gen3 Eq Phase3 Method |
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UPTP |
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DPTP |
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ACS |
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URR |
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PCI Express不支持的请求报告(URR,Unsupported Request Reporting) |
FER |
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PCI Express设备致命错误报告(FER,Fatal Error Reporting) |
NFER |
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PCI Express设备非致命错误报告(NFER,Non-Fatal Error Reporting) |
CER |
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PCI Express设备可纠正错误报告(CER,Correctable Error Reporting) |
CTO |
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/ |
SEFE |
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Root PCI Express系统错误致命错误(SEFE,System Error on Fatal Error) |
SENFE |
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非致命错误的PCI Express系统错误(SENFE,System Error on Non-Fatal Error) |
SECE |
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Root PCI Express系统错误纠正错误(SECE,System Error on Correctable Error) |
PME SCI |
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/ |
Hot Plug |
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热插拔 |
Advanced Error Reporting |
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高级错误报告 |
PCIe Speed |
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PCIE设备速度(低模式省电,高模式提供高性能) |
Transmitter Half Swing |
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/ |
Extra Bus Reserved |
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外置总线保留 |
Reserved Memory |
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保留内存 |
Reserved I/O |
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保留I/O |
PCH PCIE1 LTR |
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/ |
Snoop Latency Override |
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/ |
Snoop Latency Value |
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设置PCH PCIE的LTR Snoop时延 |
Snoop Latency Multiplier |
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设置PCH PCIE的LTR窥探延时倍增器 |
Non Snoop Latency Override |
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/ |
Non Snoop Latency Value |
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设置PCH PCIE的LTR Non Snoop时延 |
Non Snoop Latency Multiplier |
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设置PCH PCIE的LTR非Snoop延时倍数 |
Force LTR Override |
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/ |
PCIE1 LTR Lock |
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/ |
PCIE1 CLKREQ Mapping Override |
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/ |
CLKREQ Number |
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要求运行的时钟 |
USB Configuration |
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SSIC Port 1/2 |
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SSIC端口1/2 |
XHCI Disable Compliance Mode |
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XHCI链路符合性模式 |
xDCI Support |
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xDCI(USB OTG 装置) |
USB Port Disable Override |
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USB接口禁用复写功能 |
USB SS Physical Connector #0-13 |
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USB SuperSpeed物理连接器 |
USB Sensor Hub |
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USB传感器坞 |
SATA And RST Configuration |
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SATA Controller(s) |
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SATA控制器的启用和禁用 |
SATA Mode Selection |
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SATA控制器模式。AHCI模式(SATA 模式)/Intel PST Premium(RAID)模式/Optane 模式/IDE模式(模仿古老的大宽硬盘并行接口) |
PCIe Storage Dev On Port 1/3/5/7/9/11/13/15/17/21/23 |
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端口1/3/5/7/9/11/13/15/17/21/23的PCIe存储设备 |
SATA Test Mode |
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SATA测试模式 |
RAID Device ID |
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RAID设备ID |
SATA Controller Speed |
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SATA控制器速度 |
Serial ATA Port 0-7 |
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Hot Plug |
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SATA热插拔功能 |
Mechanical Presence Switch |
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对主板初次通电时系统中是否存在驱动器进行机械检测 |
Spin Up Device |
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硬盘交错旋转加速功能 |
SATA Device Type |
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所安装的SATA设备类型 |
Topology |
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SATA拓撲 |
SATA Port 0 DevSlp |
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DevSlp是一个信号,通过发送这个信号让盘进入一个非常省电的状态 |
DITO Configuration |
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DITO配置 |
DITO Value |
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设备休眠空闲超时值DITO(Device Sleep Idle Timeout),指定HBA在驱动DEVSLP信号之前应等待的时间量(大约1毫秒粒度) |
DM Value |
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DITO乘数值DM(DITO Multiplier),指定HBA应用于指定DITO值的DITO乘数,有效地将DITO的范围从1ms扩展到16368ms |
Software Feature Mask Configuration |
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HDD Unlock |
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Enabled |
激活硬盘密度解锁功能 |
LED Locate |
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|
LED定位 |
Use RST Legacy OROMDM |
|
|
|
/ |
RAID0/1/5/10 |
|
|
|
RAID 0/1/5/10模式 |
Intel Rapid Recovery Technology |
|
|
|
设置Intel Rapid Recovery Technology |
OROM UI and BANNER |
|
|
|
显示OROM UI |
IRRT Only on eSATA |
|
|
|
仅在eSATA使用英特尔快速恢复技术 |
Smart Response Technology |
|
|
|
快速反应技术 |
OROM UI Normal Delay |
|
|
|
OROM UI Splash画面在一般状态下的延迟时间 |
RST Force Form |
|
|
|
/ |
System Acceleration with Intel(R) Optane(TM) Memory |
|
|
|
通过Intel Optane技术加速系统 |
HD Audio Subsystem Configuration Settings |
|
|
|
|
HD Audio |
|
|
|
高清音频 |
Audio DSP |
|
|
|
数字信号处理器DSP(Digital Signal Processors) |
Audio DSP Compliance Mode |
|
|
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/ |
HDA-Link Codec Select |
|
|
|
HDA解码器选择 |
iDisplay Audio Disconnect |
|
|
|
显示器音频断开连接 |
PME Enable |
|
|
|
电源管理事件PME(Power Management Event),将PC设置为在收到来自连接的设备或本地网络的信号后的指定时间唤醒 |
HD Audio Subsystem Advanced Configuration Settings |
|
|
|
|
I/O Buffer Ownership |
|
|
|
I/O缓冲区所有权 |
I2S Configuration Select |
|
|
|
I2S配置选择 |
I/O Buffer Voltage Select |
|
|
|
I/O缓冲区电压选择 |
HD Audio Link Frequency |
|
|
|
/ |
iDisplay Link T-Mode |
|
|
|
/ |
Audio DSP NHLT Endpoints Configuration |
|
|
|
|
DMIC |
|
|
|
DMIC设备 |
Bluetooth |
|
|
|
蓝牙 |
I2S |
|
|
|
I2S设备 |
Audio DSP Feature Support |
|
|
|
|
WoV (Wake on Voice) |
|
|
|
语音唤醒 |
DSP based Speech Pre-Processing Disabled |
|
|
|
/ |
Voice Activity Detection |
|
|
|
声音行为检测 |
Audio DSP Pre/Post-Processing Module Support |
|
|
|
|
IntelSST Speech |
|
|
|
智能声音技术SST(Smart Sound Technology) |
Intel WoV |
|
|
|
语音唤醒WOV(Wake On Voice) |
Security Configuration |
|
|
|
|
RTC Lock |
|
|
|
在RTC RAM的低/高128字节存储区中锁定38h-3Fh字节 |
BIOS Lock |
0x8FB |
0x0 |
Disabled |
BIOS锁 |
SerialIo Configuration |
|
|
|
|
Touch Panel |
|
|
|
触控面板 |
BT/UART Mux Select |
|
|
|
/ |
I2C0-I2C5 Controller |
|
|
|
I2C0-I2C5控制器 |
SPI0/1 Controller |
|
|
|
SPI0/1控制器 |
UART0/1/2 Controller |
|
|
|
UART0/1/2控制器 |
GPIO Controller |
|
|
|
GPIO控制器 |
WITT/MITT Test Device |
|
|
|
WITT/MITT测试设备 |
WITT/MITT Device selection |
|
|
|
WITT/MITT设备选择 |
UART Test Device |
|
|
|
UART测试设备 |
UCSI/UCMC device |
|
|
|
/ |
SerialIO timing parameters |
|
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|
|
StandardSpeed SCL High for I2C1 |
|
|
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/ |
StandardSpeed SCL Low for I2C1 |
|
|
|
/ |
StandardSpeed SDA Hold for I2C1 |
|
|
|
/ |
FastSpeed SCL High for I2C1 |
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|
/ |
FastSpeed SCL Low for I2C1 |
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|
/ |
FastSpeed SDA Hold for I2C1 |
|
|
|
/ |
FastSpeedPlus SCL High for I2C1 |
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|
|
/ |
FastSpeedPlus SCL Low for I2C1 |
|
|
|
/ |
FastSpeedPlus SDA Hold for I2C1 |
|
|
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/ |
D0->D3 idle timeout for I2C1 (screen off) |
|
|
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/ |
D0->D3 idle timeout for I2C1 (screen on) |
|
|
|
/ |
D0->D3 idle timeout for SPI1 (screen off) |
|
|
|
/ |
D0->D3 idle timeout for SPI1 (screen on) |
|
|
|
/ |
D0->D3 idle timeout for UART1 (screen off) |
|
|
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/ |
D0->D3 idle timeout for UART1 (screen on) |
|
|
|
|
Serial IO I2C0/1 Settings |
|
|
|
|
Connected device |
|
|
|
已连接的设备 |
Interrupt mode |
|
|
|
中断模式 |
Device’s bus address |
|
|
|
设备总线地址 |
Device’s HID address |
|
|
|
设备HID地址 |
Device’s bus speed |
|
|
|
设备总线速度 |
Serial IO I2C2-5 Settings |
|
|
|
I2C IO电压选择 |
I2C IO Voltage Select |
|
|
|
|
Serial IO SPI0 Settings |
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|
|
|
ChipSelect polarity |
|
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/ |
Serial IO SPI1 Settings |
|
|
|
|
Enable Finger Print Sensor |
|
|
|
开启指纹传感器 |
Finger Print Sensor |
|
|
|
指纹传感器 |
Interrupt mode |
|
|
|
中断模式 |
Serial IO UART0 Settings |
|
|
|
|
Bluetooth Device |
|
|
|
蓝牙设备 |
BT Interrupt Mode |
|
|
|
BT中断模式 |
Wireless Charging Mode |
|
|
|
无线充电模式 |
Hardware Flow Control |
|
|
|
硬件流控制 |
Serial IO UART1/2 Settings |
|
|
|
|
Hardware Flow Control |
|
|
|
硬件流控制 |
GPIO Configuration |
|
|
|
|
GPIO IRQ Route |
|
|
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/ |
SkyCam Configuration |
|
|
|
|
SkyCam CIO2 Device |
|
|
|
SkyCam CI02设备 |
Control Logic 0-3 |
|
|
|
/ |
Link0-3 |
|
|
|
/ |
PORT-A/B/C/D HS-RXEN/TEM-EN Override |
|
|
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/ |
PORT-A/B/C/D CTLE |
|
|
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/ |
PORT-A/B/C/D CTLE CAP Value |
|
|
|
/ |
PORT-A/B/C/D CTLE RES Value |
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|
|
/ |
PORT-A/B/C/D TRIM |
|
|
|
/ |
PORT-A/B/C/D Data Trim Value |
|
|
|
/ |
PORT-A/B/C/D Clk Trim Value |
|
|
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/ |
Link0-3 |
|
|
|
|
Sensor Model |
|
|
|
传感器型号 |
Lanes Clock division |
|
|
|
/ |
GPIO control |
|
|
|
GPIO控制 |
Flash Support |
|
|
|
闪光支持 |
Privacy LED |
|
|
|
隐私LED |
Rotation |
|
|
|
旋转 |
PMIC Position |
|
|
|
电源管理IC,PMIC(Power Management IC) |
Voltage Rail |
|
|
|
/ |
LaneUsed |
|
|
|
/ |
MCLK |
|
|
|
微控制器核心MCLK(the microcontroler core) |
EEPROM Type |
|
|
|
电子抹除式可复写唯读记忆体EEPROM/E 2 PROM(Electrically-Erasable Programmable Read-Only Memory)是可以通过电子方式多次复写的半导体储存装置,用特定电压抹除晶片上的数据,以便写入新的数据 |
VCM Type |
|
|
|
/ |
Number of I2C Components |
|
|
|
I2C组件数量 |
I2C Channel |
|
|
|
I2C设备频道 |
Control Logic options |
|
|
|
|
Control Logic Type |
|
|
|
/ |
CRD Version |
|
|
|
自定义资源定义CRD(Custom Resource Definition) |
PMIC Flash Panel |
|
|
|
电源管理IC,PMICs(Power management ICs) |
I2C Channel |
|
|
|
I2C设备频道 |
I2C Address |
|
|
|
I2C设备地址 |
WLED1 Type |
|
|
|
/ |
WLED1 Flash Max Current |
|
|
|
/ |
WLED1 Torch Max Current |
|
|
|
/ |
WLED2 Type |
|
|
|
/ |
WLED2 Flash Max Current |
|
|
|
/ |
WLED2 Torch Max Current |
|
|
|
/ |
Number of GPIO Pins |
|
|
|
GPIO Pin值 |
GPIO 0-3 |
|
|
|
|
Group Pad Number |
|
|
|
平板组号 |
Group Number |
|
|
|
组号 |
Function |
|
|
|
功能 |
Active Value |
|
|
|
活跃值 |
Initial Value |
|
|
|
初始值 |
SCS Configuration |
|
|
|
|
eMMC 5.0 Controller |
|
|
|
eMMC5.0控制器 |
eMMC 5.0 HS400 Mode |
|
|
|
/ |
Driver Strength |
|
|
|
驱动强度,数值越大表示信号强度越高 |
SDCard 3.0 Controller |
|
|
|
SD卡3.0控制器 |
SDCard Sideband Events |
|
|
|
/ |
ISH Configuration |
|
|
|
|
ISH Controller |
|
|
|
集成传感器中枢ISH(Integrated Sensor Hub) |
TraceHub Configuration Menu |
|
|
|
|
TraceHub Enable Mode |
|
|
|
/ |
MemRegion 0-1 Buffer Size |
|
|
|
/ |
Pch Thermal Throttling Control |
|
|
|
|
Thermal Throttling Level |
|
|
|
/ |
T0-T2 Level |
|
|
|
/ |
DMI Thermal Setting |
|
|
|
/ |
Thermal Sensor 0-3 Width |
|
|
|
/ |
SATA Thermal Setting |
|
|
|
/ |
Port 0-1 |
|
|
|
|
T1-T3 Multipler |
|
|
|
/ |
Tdispatch |
|
|
|
/ |
Tinactive |
|
|
|
/ |
Boot |
|
|
|
|
Setup Prompt Timeout |
|
|
2 Note 1 |
进入系统前BIOS等待按Delete的时间 |
Bootup NumLock State |
|
|
|
开机时开启小键盘 |
Quiet Boot |
|
|
|
快速启动 |
Fast Boot |
|
|
Disabled |
快速启动 |
SATA Support |
|
|
|
SATA支持 |
VGA Support |
|
|
|
VGA支持 |
PS2 Devices Support |
|
|
|
PS2设备支持 |
NetWork Stack Driver Support |
|
|
|
网络堆栈驱动支持 |
Redirection Support |
|
|
|
/ |
Advanced |
|
|
|
|
Internal Pointing Device |
|
|
|
设置定点设备 |
Wake On Lid Open |
|
|
|
开盖唤醒 |
Intel Virtualization Technology |
|
|
|
开放部分CPU缓存接口以提升虚拟机的IO性能(会降低CPU缓存性能) |
Intel AES-NI |
|
|
|
Intel进阶加密指令集AES-NI(Advanced Encryption Standard New Instructions)通过硬件加速AES的加密解密 |
VT-d |
|
|
Enabled |
通过DMAR ACPI表向VMM报告I/O设备分配,为定向I/O(VT-d)启用/禁用Intel VT |
Graphics Configuration |
|
|
|
|
DVMT Pre-Allocated |
|
|
|
选择内部显卡使用的预分配图形内存大小(存在外部显卡时无效) |
SATA Configuration |
|
|
|
|
SATA Mode Selection |
|
|
|
SATA模式选择 |
Boot |
|
|
|
|
Launch PXE OpROM policy |
|
|
|
运行预启动执行环境兼容支持 |
I/O Interface Security |
|
|
|
|
Wireless Network Interface |
|
|
|
无线网络接口 |
LAN Network Interface |
|
|
|
LAN网络接口 |
SATA ODD Interface |
|
|
|
SATA ODD接口 |
HD Audio Interface |
|
|
|
HD音频接口 |
USB Interface Security |
|
|
|
|
USB Interface |
|
|
|
USB接口 |
External Ports |
|
|
Disabled |
系统将该接口识别为内置/外置接口 |
BlueTooth |
|
|
|
蓝牙 |
CMOS Camera |
|
|
|
CMOS相机 |
Card Reader |
|
|
|
读卡器 |
Smart Card Reader |
|
|
|
智能读卡器 |
Finger Print |
|
|
|
指纹记录 |
LTE |
|
|
|
/ |
Secure Boot |
|
|
|
|
Secure Boot Control |
|
|
Disabled |
安全引导功能 |
PCI Subsystem Settings |
|
|
|
|
Above 4G Decoding |
|
|
|
64位PCIe设备的内存映射I/O到4GB或更大的地址空间 |
Hot-Plug Support |
|
|
|
热插拔支持 |
Trusted Computing |
|
|
|
|
Security Device Support |
|
|
|
安全设备支持 |
SMART Settings |
|
|
|
|
SMART Self Test |
|
|
|
SMART自检 |
Memory Configuration |
|
|
|
|
MRC ULT Safe Config |
|
|
|
/ |
Maximum Memory Frequency |
|
|
|
最大内存工作频率 |
HOB Buffer Size |
|
|
|
/ |
ECC Support |
|
|
|
错误校正码ECC(Error-Correcting Code) |
Max TOLUD |
|
|
|
设定TOLUD的最大值。动态分配将依据所安装的显示控制器的最大MMIO长度来自动调整TOLUD值 |
SA GV |
|
|
|
SA速度增强速度步长 |
SA GV Low Freq |
|
|
|
/ |
Retrain on Fast Fail |
|
|
|
/ |
Command Tristate |
|
|
|
开启DRAM节电功能 |
Enable RH Prevention |
|
|
|
/ |
Row Hammer Solution |
|
|
|
/ |
RH Activation Probability |
|
|
|
以可调的概率刷新行 |
Exit On Failure (MRC) |
|
|
|
退出时显示失败信息 |
MC Lock |
|
|
|
/ |
Probeless Trace |
|
|
|
/ |
GDXC IOT size |
|
|
|
/ |
GDXC MOT size |
|
|
|
/ |
Memory Trace |
|
|
|
/ |
Enable/Disable IED (Intel Enhanced Debug) |
|
|
|
/ |
Ch Hash Support |
|
|
|
/ |
Ch Hash Mask |
|
|
|
/ |
Ch Hash Interleaved Bit |
|
|
|
校验和和数据有效性/完整性检查 |
VC1 Read Metering |
|
|
|
/ |
VC1 RdMeter Time Window |
|
|
|
/ |
VC1 RdMeter Threshold |
|
|
|
/ |
Strong Weak Leaker |
|
|
|
/ |
Memory Scrambler |
|
|
|
内存扰频器,用于支持内存错误纠正 |
Force ColdReset |
|
|
|
MRC执行期间需要冷引导时使用 |
Channel A DIMM Control |
|
|
|
启用/禁用A DIMM插槽通道 |
Channel B DIMM Control |
|
|
|
启用/禁用B DIMM插槽通道 |
Force Single Rank |
|
|
|
启用后每个内存只使用Rank0 |
Memory Remap |
0x8A7 |
0x1 |
Enabled |
支持64位系统重新指派内存地址(如果主板上安装了4GB或以上的内存,PCI内存资源将与总物理内存重叠。此功能将重叠的物理内存重新分配到高于总物理内存的位置) |
Time Measure |
|
|
|
时长测量 |
DLL Weak Lock Support |
|
|
|
/ |
Pwr Down Idle Timer |
|
|
|
/ |
Mrc Fast Boot |
|
|
|
MRC快速启动,没有内存训练,可以加快启动 |
Lpddr Mem WL Set |
|
|
|
/ |
EV Loader |
|
|
|
/ |
EV Loader Delay |
|
|
|
/ |
Memory Training Algorithms |
|
|
|
|
Early Command Training |
|
|
|
延迟并偏移DDR时钟,以使所有命令行与时钟同步 |
SenseAmp Offset Training |
|
|
|
感测放大器将感测来自表示存储单元中存储的数据位(1或0)的位线的低功率信号,并将较小的电压摆幅放大到可识别的逻辑电平,以便可以由存储器外部的逻辑正确地解释数据 |
Early ReadMPR Timing Centering 2D |
|
|
|
/ |
Read MPR Training |
|
|
|
/ |
Receive Enable Training |
|
|
|
调整I/O并使接收器准备好以所需速度/定时开始运行 |
Jedec Write Leveling |
|
|
|
向DDR3添加写平衡,以消除命令/地址/控制/时钟总线与每个DRAM数据总线之间的时滞 |
Early Write Time Centering 2D |
|
|
|
/ |
Early Write Drive Strength/Equalization |
|
|
|
/ |
Early Read Time Centering 2D |
|
|
|
/ |
Write Timing Centering 1D |
|
|
|
调整跨DIMM写入DRAM的延迟,测试并调整终止设置(仅影响写延迟) |
Write Voltage Centering 1D |
|
|
|
/ |
Read Timing Centering 1D |
|
|
|
内存控制器会将测试数据写入RAM,然后将其接收回去,以执行步长和延迟补偿 |
Dimm ODT Training* |
|
|
|
片上端接ODT(On-Die Termination)减少内存总线信号中的电噪声,并消除这些电信号在高速传输线上的电信号反弹痕迹 |
Max RTT_WR |
|
|
|
/ |
DIMM RON Training* |
|
|
|
此功能有助于使DIMM的I/O上的电阻趋于稳定 |
Write Drive Strength/Equalization 2D* |
|
|
|
/ |
Write Slew Rate Training* |
|
|
|
/ |
Read ODT Training* |
|
|
|
/ |
Read Equalization Training* |
|
|
|
/ |
Read Amplifier Training* |
|
|
|
正确恢复/均衡通过引脚接收的数据 |
Write Timing Centering 2D |
|
|
|
测试在DRAM无法成功写入之前,每个方向DRAM可移动多少步(会同时测试时间和延迟) |
Read Timing Centering 2D |
|
|
|
测试在DRAM无法成功写入之前,每个方向DRAM可移动多少步(会同时测试时间和延迟) |
Command Voltage Centering |
|
|
|
存储器控制器的电压幅度测试 |
Write Voltage Centering 2D |
|
|
|
测试在DRAM无法成功写入之前,每个方向DRAM可移动多少步(会同时测试时间和延迟) |
Read Voltage Centering 2D |
|
|
|
测试在DRAM无法成功写入之前,每个方向DRAM可移动多少步(会同时测试时间和延迟) |
Late Command Training |
|
|
|
调整高层延迟并运行模式测试 |
Round Trip Latency |
|
|
|
RTL参数定义在发出读取CAS命令后数据返回到存储控制器之前经过的存储控制器周期数。 RTL设置用于微调DRAM缓冲区输出延迟 |
Turn Around Timing Training |
|
|
|
命令/数据从内存控制器发送到DIMM,然后返回到内存控制器时的延迟 |
Rank Margin Tool |
|
|
|
显示有关上面列出的各种设置的测试结果和边距数据 |
Memory Test |
|
|
|
内存测试 |
DIMM SPD Alias Test |
|
|
|
对正确SPD数据的逻辑检查 |
Receive Enable Centering 1D |
|
|
|
/ |
Retrain Margin Check |
|
|
|
/ |
Write Drive Strength Up/Dn independently |
|
|
|
/ |
CMD Slew Rate Training |
|
|
|
/ |
CMD Drive Strength / Tx Equalization |
|
|
|
/ |
CMD Normalization |
|
|
|
/ |
Memory Thermal Configuration |
|
|
|
|
Memory Thermal Management |
|
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Enabled |
内存热管理开关 |
PECI Injected Temperature |
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通过PECI注入处理器的内存温度 |
EXTTS# via TS-on-Board |
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将板载TS路由注入PCH上的EXTTS#引脚 |
EXTTS# via TS-on-DIMM |
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插入到PCH引脚上的TS-on-DIMM路由 |
Virtual Temperature Sensor (VTS) |
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虚拟温度传感器 |
Memory Power and Thermal Throttling |
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DDR PowerDown and idle counter |
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控制DDR掉电模式和空闲计数器的方式。PCODE为硬件算法控制,BIOS为BIOS控制 |
REFRESH_2X_MODE |
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启用REFRESH 2X模式,当温度为WARM或HOT时,通过提高DRAM刷新率以维持可接受的总体错误率。0表示禁用,1表示WARM或HOT时启用,2表示HOT时启用 |
LPDDR Thermal Sensor |
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启用后MC使用MR4读取LPDDR热传感器 |
SelfRefresh Enable |
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允许用户在处理器不可用以刷新DRAM阵列时将数据保存在DRAM中 |
SelfRefresh IdleTimer |
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可用范围64K-1到512 |
Throttler CKE Min Defeature |
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/ |
Throttler CKE Min Timer |
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CKE计时器最小值。可用范围[255;0] |
Dram Power Meter |
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Use user provided power weights, scale factor, and channel power floor values |
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是否使用用户提供的功率权重/比例因子/基于DIMM的通道电源下限值,禁用则由BIOS设置功率权重,由系统设置比例因子/基于DIMM的通道电源下限值 |
Energy Scale Factor |
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能量比例因子,范围[7;0]=[7.3pJ;931.3pJ] |
Idle Energy Ch0/1Dimm0/1 |
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当cke开启且DIMM处于空闲状态时,DIMM消耗一个时钟周期的空闲能量。范围[63;0] |
PowerDown Energy Ch0/1Dimm0/1 |
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当cke关闭且DIMM处于关闭状态且空闲时,DIMM在一个时钟周期内消耗的能量。范围[63;0] |
Activate Energy Ch0/1Dimm0/1 |
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激活能量贡献。范围[255;0] |
Read Energy Ch0/1Dimm0/1 |
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读能源贡献。范围[255;0] |
Write Energy Ch0/1Dimm0/1 |
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写能源贡献。范围[255;0] |
Memory Thermal Reporting |
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Lock Thermal Management Registers |
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Disabled |
锁定热管理寄存器,开启时几个与DDR电源/热量管理相关的PCU寄存器将无法写入 |
Extern Therm Status |
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pcode使用/忽略外部热状态 |
Closed Loop Therm Manage |
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使用CTLM pcode算法计算内存热状态(CLTM优先于OLTM) |
Open Loop Therm Manage |
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使用OLTM pcode算法计算内存热状态(CLTM优先于OLTM) |
Warm Threshold Ch0 Dimm0 |
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范围[255;0] |
Warm Threshold Ch0 Dimm1 |
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范围[255;0] |
Warm Threshold Ch1 Dimm0 |
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范围[255;0] |
Warm Threshold Ch1 Dimm1 |
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范围[255;0] |
Hot Threshold Ch0 Dimm0 |
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范围[255;0] |
Hot Threshold Ch0 Dimm1 |
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范围[255;0] |
Hot Threshold Ch1 Dimm0 |
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范围[255;0] |
Hot Threshold Ch1 Dimm1 |
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范围[255;0] |
Warm Budget Ch0 Dimm0 |
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范围[255;0] |
Warm Budget Ch0 Dimm1 |
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范围[255;0] |
Hot Budget Ch0 Dimm0 |
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范围[255;0] |
Hot Budget Ch0 Dimm1 |
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范围[255;0] |
Warm Budget Ch1 Dimm0 |
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范围[255;0] |
Warm Budget Ch1 Dimm1 |
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范围[255;0] |
Hot Budget Ch1 Dimm0 |
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范围[255;0] |
Hot Budget Ch1 Dimm1 |
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范围[255;0] |
Memory RAPL |
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Rapl Power Floor Ch0 |
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功率预算,范围[255;0],其中0=5.3W |
Rapl Power Floor Ch1 |
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功率预算,范围[255;0],其中0=5.3W |
RAPL PL Lock |
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锁定RAPL限制寄存器 |
RAPL PL 1 enable |
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RAPL 1功率限制 |
RAPL PL 1 Power |
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RAPL 1的DDR域功率限制,范围[0,2047],即[0,2047.875]W |
RAPL PL 1 WindowX |
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RAPL 1的DDR功率限制时间长度的X值,实际时间长度计算公式为(1/1024)*(1+(x/4))*(2^y) ,单位为秒 |
RAPL PL 1 WindowY |
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RAPL 1的DDR功率限制时间长度的Y值,实际时间长度计算公式为(1/1024)*(1+(x/4))*(2^y) ,单位为秒 |
RAPL PL 2 enable |
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RAPL 2功率限制 |
RAPL PL 2 Power |
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RAPL 2的DDR域功率限制,范围[0,2047],即[0,2047.875]W |
RAPL PL 2 WindowX |
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RAPL 2的DDR功率限制时间长度的Y值,实际时间长度计算公式为(1/1024)*(1+(x/4))*(2^y) ,单位为秒 |
RAPL PL 2 WindowY |
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RAPL 2的DDR功率限制时间长度的Y值,实际时间长度计算公式为(1/1024)*(1+(x/4))*(2^y) ,单位为秒 |
CPU Fan Speed |
0x2C4 |
0x64 |
Maximum |
风扇转速 |
FAN1 Device |
0x2EA |
0x1 |
Enabled |
FAN1设备 |
FAN2 Device |
0x2EB |
0x1 |
Enabled |
FAN2设备 |
Generic Device 4 |
0x371 |
0x1 |
Enabled |
开启第四个核心 |